Find the most up-to-date version of JEDEC JESD at Engineering Environmental Acceptance. Requirements for Tin Whisker. Susceptibility of Tin and Tin Alloy. Surface Finishes. JESD MARCH JEDEC SOLID STATE . JEDEC standard JESD22A, Measuring Whisker Growth on Tin and Tin Alloy The JEDEC standard JESD , Environmental Acceptance.

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Current search Search found 9 items. The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry.

The predominant terminal finishes on electronic components have been Sn-Pb alloys. External visual inspection is an examination of the external surfaces, construction, marking, and workmanship of a finished package or component. The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols iesd the solid state industry Committee s: Quality and Reliability of Solid State Products filter.

Standards & Documents Search | JEDEC

Quality and Reliability of Solid State Products filter. This publication jedd provides guidance in the selection of reliability modeling parameters, namely functional form, apparent thermal activation energy values and sensitivity to stresses such as power supply voltage, substrate current, current density, gate voltage, relative humidity, temperature cycling range, mobile ion concentration, etc.

Terms, Definitions, and Symbols filter JC Search by Keyword or Document Number. Filter by document type: External visual is a noninvasive and nondestructive test. This publication provides a list of failure mechanisms and jsd associated activation energies or acceleration factors that may be used in making system failure rate estimations when the only available data is based on tests performed at accelerated stress test conditions.

The potential effectiveness of various mitigation practices will also be briefly discussed. It establishes a set of data elements that describes the component and defines what each element means.

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Pure Sn and Sn-based jeesd electrodeposits and solder-dipped finishes may grow tin whiskers, which could electrically short across component terminals or break off the component and degrade the performance of electrical or mechanical parts. Jess May JESDA Sep The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers. This reference for technical writers and educators, manufacturers, and buyers and users of discrete solid state devices is now available.

Standards & Documents Search

Each of the approximately two thousand entries is referenced to its source publication, and an annex listing the names of the source publications and their releases dates is included. Current search Search found 2 items. As the industry moves toward Pb-free components and assembly processes, the predominant terminal finish materials will be pure Sn and alloys of Sn, including Sn-Bi and Sn-Ag.

Multiple Chip Packages JC Registration or login required. This methodology may not be sufficient for applications with special requirements, i. Reaffirmed May JESDA Sep The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers.

Filter by document type: Registration or login required. Multiple Chip Packages JC References behind each of the theories and mitigation practices are provided.

Solid State Memories JC As the industry moves toward Pb-free components and assembly processes, the predominant terminal finish materials will hesd pure Jssd and alloys of Sn, including Sn-Bi and Sn-Ag Pure Sn and Sn-based alloy electrodeposits and solder-dipped finishes may grow tin whiskers, which could electrically short across component terminals or break off the component and degrade the performance of electrical or mechanical parts.

Additional requirements jewd be specified in jexd appropriate requirements procurement documentation. Learn more and apply today.

This reference for technical writers and educators, manufacturers, and buyers and users of discrete solid state devices is now available. It is functional for qualification, quality monitoring, and lot acceptance. Each of the approximately jewd thousand entries is referenced to its source publication, and an annex listing the names of the source publications and their releases dates is included.

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The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers. Solid State Memories JC The purpose of this dictionary jdsd to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry. Show 5 results per page.

Most of the content on this site remains free to download with registration. This methodology may not be sufficient for applications with special requirements, i. This document will provide insight into the theory behind tin whisker formation as it is known today and, based on jeed knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation.

Terms, Definitions, and Symbols filter JC The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry Committee s: It should aid the technical committees of JEDEC in the avoidance of multiple definitions and reduce the proliferation of redundant definitions.

The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers. Search by Keyword or Document Number. Displaying 1 – 9 of 9 documents. Additional requirements may be specified in the appropriate requirements procurement documentation.